The lead-free solder paste developed by EUNOW is mixed of lead-free solder powder with extremely low surface oxidation and flux paste with excellent chemical stability. It has good application, soldering wettability and post-soldering reliability. Please select the appropriate product according to the specific application and purpose. Halogen free type solder paste is available to each application.
DW-1000: No-clean low-temperature lead-free solder paste, based on Eunow low-temperature lead-free patented alloy LTS037 (CN105195915), applied to PC, especially NB SMT assembly. The solder paste reflow peak temperature <200°C,effectively solves the Non Wetting Open (NWO),beacuse of the component and PCB warpage caused by high temperature reflow of SAC solder paste. The Eunow DW-1000 participates in the iNEMI low temperature assembly project test initiated by Intel and performances well in terms of printability, Bi-phase fusion, and IMC thickness stability.
This product is a Sn96.5 Ag3.0 Cu0.5 lead-free solder paste, and specifically designed for the application of POP process.Consistent amount of solder paste transferred during working life.Long working life in solder paste tray.Nitrogen reflow is recommended(O2<1500ppm)
No-clean SAC305 solder paste, special formulat designed for fine pitch printing.Good wettability for micro-pad, anti BGA head-in-pillow, low void.