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SMT application solder paste

Profile information:
No-clean SAC305 solder paste, special formulat designed for fine pitch printing.Good wettability for micro-pad, anti BGA head-in-pillow, low void.
Basic Information
Detailed parameters
Number:
EUP-100F
Categories:
Solder Paste
Application Field
Mobile device of smart phone, tablet PC
Packing Specification
500g
heat:
number:
- +
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Product Description

 

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Solder paste for semiconductor packaging