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Paste Preform
For more details, please contact our application engineers.
Basic Information
Detailed parameters
Number:
Categories:
Solder Preform
Application Field
Electronics assembly, PCB assembly, automotive component assemblies, connectors and end devices, chip connections, power module substrate attachment, filter connectors, and more.
Packing Specification
Paste Preform is packaged in a variety of ways, including canned, tape and reel packaging and tray packaging,and can also be packaged according to customer requirements.
heat:
number:
-
+
keywords: